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All Journal JURNAL INTEGRASI Journal of Applied Electrical Engineering
Nur Sakinah Asaad
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Control & Systems Engineering Electrical & Electronics Engineering Other

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Desain Sistem Functional Test RFID Chips Array untuk Proses Manufaktur Smart Card pada TFME Politeknik Negeri Batam Nanta Fakih Prebianto; Nur Sakinah Asaad; Riki Ria
Journal of Applied Electrical Engineering Vol 4 No 2 (2020): JAEE, December 2020
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v4i2.2743

Abstract

Proses pengembangan dan produksi smart card dilakukan pada Teaching Factory Manufacturing of Electronics (TFME) Politeknik Negeri Batam. Pada proses produksi smart card perlu dikembangkan sistem pengujian sample untuk memastikan hasil wiring dan proses die attach berhasil yang ditandai dengan komunikasi antara chip dan RFID reader (13,56 MHz). Pendekatan yang dilakukan adalah merancang sistem uji fungsi RFID otomatis dengan memanfaatkan pergerakan tiga axis dan mini probe yang melekat pada pad sambungan wire bond dan die. Metode yang digunakan pada penelitian ini terdiri dari perancangan mekanik, perancangan elektrik, perancangan perangkat lunak, dan pengujian sistem. Resistansi probe RFID memiliki resistansi 1,8 Ohm. Pergerakan setiap axis menggunakan motor stepper yang dikopling dengan ulir linear T8 2pitch 4star. Torsi yang terukur pada axis x, y, dan z adalah 4.64 N.mm, 59,54 N.mm, dan 10,72 N.mm pada saat stepper bergerak maju.
Penggunaan SEM dan Image-J dalam Mempelajari Ketebalan Lapisan Mikrostruktur Muhammad Iqbal; Muhammad Firdaus; Muhammad Al Fauzan; Meilan Novayanti; Fathiyyah Syahidah Sujana; M. Rifan Maulana; Hana Mutialif Maulidiah; Widya Rika Puspita Rika Puspita; Mustanir Mustanir; Adlian Jefiza; Budiana Budiana; Nur Sakinah Asaad
Journal of Applied Electrical Engineering Vol 5 No 2 (2021): JAEE, December, 2021
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v5i2.3746

Abstract

Telah dilakukan penelitian terkait dengan ketebalan lapisan mikrostruktur dengan menggunakan SEM (Scanning Electron Microscope) dan Image-J. Sampel diuji dengan menggunakan SEM untuk mendapatkan mikrostruktur dari sampel. Setelah mikrostruktur didapatkan maka dilakukan analisa ketebalan lapisan mikrostruktur dengan menggunakan teknik pengukuran secara langsung menggunakan SEM dan teknik pengukuran tidak langsung menggunakan aplikasi Image-J. Berdasarkan hasil penelitian yang telah dilakukan, pengukuran ketebalan lapisan dengan menggunakan SEM dan Image-J menunjukkan pola kurva yang sama untuk semua ketebalan lapisan. Persentase perbedaan pengukuran ketebalan lapisan dengan menggunakan SEM dan Image J adalah 0.7% untuk lapisan ke-1, 1,6 % untuk lapisan ke-2 dan 0.8 % untuk lapisan ke-3. Persentase perbedaan tersebut sangat kecil (<2%) sehingga aplikasi Image-J ini dapat digunakan sebagai alternatif di dalam pengukuran ketebalan lapisan mikrostruktur
MODIFIKASI MESIN TRIM FORM PADA PROSES PENGEMASAN INTEGRATED CIRCUIT UNTUK PENURUNAN DAMAGED LEAD Nur Sakinah Asaad; Purwanto Purwanto
JURNAL INTEGRASI Vol 12 No 1 (2020): Jurnal Integrasi - April 2020
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (1025.963 KB) | DOI: 10.30871/ji.v12i1.1889

Abstract

Integrated circuit (IC) packaging process of Low Profile Quad Flat Package (LQFP) needs trim form machine for trimming the dambar and forming the IC leads before separated from the lead frame. One of the process sequences in trim form machine is offload, placement of IC units in the tray by pick and place module including open and close of turn table movement to adjust space between lead frame columns before transferred to tray. Open and close movement of the turn table impact to damaged lead production defect. Modification intended to misalignment earlier detection so that the machine can stop automatically and decrease production defect by adding two proximity sensor on turn table. Based on the result of this research, the error on turn table could be reduced to 88% with assembly yield achieved 99.985% or increase up to 0.07%.
DESIGN OF EXPERIMENT (DOE) LIQUID PHOTOIMAGEABLE SOLDER MASKS PCB PADA TEACHING FACTORY MANUFACTURING OF ELECTRONICS (TFME) POLITEKNIK NEGERI BATAM Nadhrah Wivanius; Nur Sakinah Asaad; Heru Wijanarko; Ira Zamzami
JURNAL INTEGRASI Vol 12 No 1 (2020): Jurnal Integrasi - April 2020
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (788.177 KB) | DOI: 10.30871/ji.v12i1.1987

Abstract

This paper examines several variables to formulated the best parameters in the PCB manufacturing process. This study was implements a PCB with a screen printing process that uses the LPISM (Liquid Photoimageable Solder Mask) application. Where in the process PCB coating is done by connecting the amount of solder liquid mask in one coating using the right parameters using the Design of Experiment (DoE) method. This DoE method improves the quality of the PCB at the lowest possible cost. DoE on LPISM applied at the Teaching Factory Manufaktur Elektronika Politeknik Negeri Batam with the aim of protecting the PCB lines from being connected to one another, providing the right measurements, and using the use of laminated mask solder. Thus, Politeknik Negeri Batam Teaching Factory laboratory assistants can produce PCBs using the LPISM method with quality according to standards. From the analysis, obtained an appropriate angle for screen printing is between 150-200 so that the screen is not damaged. In addition, the oven process can thin the solder mask up to 70-80%. In accordance with the results of comprehensive testing, the 24th data obtained can be recommended because it fulfill the IPC-SM-840C standard, with the 2.5 μm solder mask thickness.
Design of Experiment pada proses Immersion Tin Plating Widya Rika Puspita; Lindawani Siregar; Ika Karlina Laila NS; Ira Zamzami; Budiana Budiana; Fitriyanti Nakul; Nur Sakinah Asaad; Adlian Jefiza
JURNAL INTEGRASI Vol 14 No 2 (2022): Jurnal Integrasi - Oktober 2022
Publisher : Pusat Penelitian dan Pengabdian Masyarakat Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/ji.v14i2.4035

Abstract

PCB (printed circuit board) is a copper-coated board that is a container for electronic components arranged to form electronic circuits. Copper surfaces that are easy to oxidize (corrosion) need to be soothed with a layer of Sn (tin). Based on the TFME study case, the electroplating technique requires more cost for tin plating. The immersion process of the tin plating model is superior in terms of cost and quality. To determine the right combination parameters so as to obtain a thickness that is in accordance with the IPC-4554 standard, namely a minimum of 1000 nm, the research method used is Design of Experiments (DoE). There are nine experimental combinations of the DoE results. Combination parameter testing is done using a SEM (scanning electron microscope) machine. The combination of four to nine has met IPC standards with a thickness of between 1040-1540 nm. The correct parameter is obtained by the combination of 5 with the parameter temperature of 700 and time of 60 minutes, and the result is an average thickness of 1.2 µm and has an uncertain value of the measurement is 7.
Identifikasi Label Kode Leadframe pada Sistem Uji Fungsi RFID Chip Berbasis Template Matching Nanta Fakih Prebianto; Ikhwan Heprilnez Pratama; Nur Sakinah Asaad; Anugerah Wibisana; Hendawan Soebhakti
Journal of Applied Electrical Engineering Vol 7 No 1 (2023): JAEE, June 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i1.5489

Abstract

The label code in a production process has an important function as an identifier. Making label code on leadframe can be done by laser engraving or painting method. The RFID chip is moved to the leadframe media to carry the signal from the die level to the outside circuit. The conductivity function test is carried out to ensure the circuit works after the die attach and wire bond processes from the RFID chip. Based on the case study on TFME, the results of this function test are stored with manual labeling. The template matching method is applied to read the leadframe label code which will then be scanned in the form of a test technical report. This label identification system uses a Raspberry Pi 3 equipped with a Sony IMX219V2 camera with a resolution of 8 MP. 2 characters that are similar, namely numbers 2 and Z, are eliminated from the sample. In addition, the label code is made in characters with vertical and horizontal lines. In this result, a success rate of 100%. This identified label code then becomes the leadframe identification number in the form of a report file that is stored in a document format.
Co-Authors Adlian Jefiza Anugerah Wibisana Budiana Budiana Fathiyyah Syahidah Sujana Fitriyanti Nakul Hana Mutialif Maulidiah Hendawan Soebhakti Heru Wijanarko Ika Karlina Laila NS Ikhwan Heprilnez Pratama Ira Zamzami Lindawani Siregar M. Rifan Maulana Meilan Novayanti Muhamad Azis Firdaus Muhammad Al Fauzan Muhammad Iqbal Mustanir Mustanir Nadhrah Wivanius Nanta Fakih Prebianto Purwanto Purwanto Riki Ria Widya Rika Puspita Widya Rika Puspita Rika Puspita