JURNAL INTEGRASI
Vol 14 No 1 (2022): Jurnal Integrasi - April 2022

Study of Lead-Free Solder Joint Reliability

Hana Mutialif Maulidiah (Politeknik Negeri Batam)
Budiana Budiana (Politeknik Negeri Batam)
Widya Rika Puspita (Politeknik Negeri Batam)
Adlian Jefiza (Politeknik Negeri Batam)
Mustanir Mustanir (Politeknik Negeri Batam)



Article Info

Publish Date
13 Apr 2022

Abstract

Solders are essential for the construction of many engineering materials. The use of soldering in electronic packaging has become increasingly critical in today's world. In the electronic manufacturing industry, alternative soldering materials based on tin metal have developed gradually over the last two decades. Manufacturing companies are primarily concerned about removing lead from electronic manufacturing and waste recycling by switching to the lead-free solder. Environmental and human health are adversely affected by exposure to high lead levels in consumer products. The manufacturing industry has switched to lead-free soldering to support their social responsibility initiatives. The three categories of lead-free solder are classified according to temperature range: high-temperature solder, medium-temperature solder, and low-temperature solder. This research is conducted based on the approach of study literature, which is obtained from some papers that generally explain lead-free solder. To provide additional knowledge which is expected to add new insights about the importance of lead-free usage and its behavior.

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Journal Info

Abbrev

JI

Publisher

Subject

Other

Description

Terbit dua kali setahun pada bulan April dan Oktober: mulai Volume 10, Nomor 1, April 2018. Berisi tulisan yang diangkat dari hasil penelitian di bidang Teknologi Terapan. e-ISSN: ...