Makara Journal of Technology
Vol. 25, No. 1

Analysis of the Interfacial Reaction between Bulk Metallic Glass Coated Copper, Nickel, and Titanium with Lead-Free Solders

Laksono, Andromeda Dwi (Unknown)
Yen, Yee-wen (Unknown)
Tanjung, Rifqi Aulia (Unknown)
Amatosa, Teodoro A. (Unknown)
Harwahyu, Ruki (Unknown)

Article Info

Publish Date
01 Apr 2021

Abstract

Bulk metallic glass (BMG) has good mechanical strength, high hardness, wear resistance, and corrosion resistance with promising application in various industries. However, for the industrial production of BMG, the main issue is how to overcome limitations of joining with other materials. The present study focuses on solder processing at low operating temperature to avoid exceeding the recrystallization temperature. A feasible joining process for BMG was developed using lead-free solders. The BMG surface is pre-plated with copper, nickel, or titanium as a wetting layer. The reaction temperature is set between the glass transition temperature of BMG and the melting point of the solder. After a reflowing and aging process, the joint sample was examined using SEM, EDS, EPMA, and XRD. The Cu–Zr based BMG can be successfully joined with Sn-58Bi solder after plating Cu on the BMG surface. A diffusion layer was observed and the thickness increased with longer aging time. The main components of the diffusion layer are ZrO2 and Cu10Zr7.

Copyrights © 2021




Citation Download
RIS
EndNote, Reference Manager, ProCite
BibTex
Latex, Jabref
Original Source
Download Original
Google Scholar
Check in Google Scholar
Journal Info
Makara Journal of Technology
Website

Abbrev

publication:mjt

Publisher

Universitas Indonesia

Subject

Chemical Engineering, Chemistry & Bioengineering Civil Engineering, Building, Construction & Architecture Electrical & Electronics Engineering Engineering Materials Science & Nanotechnology Mechanical Engineering

Description

MAKARA Journal of Technology is a peer-reviewed multidisciplinary journal committed to the advancement of scholarly knowledge and research findings of the several branches of Engineering and Technology. The Journal publishes new results, original articles, reviews, and research notes whose content ...