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All Journal International Journal of Electrical and Computer Engineering ComEngApp : Computer Engineering and Applications Journal
Lelyzar Siregar
Universitas Sumatera Utara
Computer Science & IT Electrical & Electronics Engineering Engineering

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SeamSAR: Seamless, Secure And Robust Handover Model for Mobile IPTV Network Using Enhanced FMIPv6 Ismat Aldmour; Thair Al-Dala’in; Lelyzar Siregar; Rahmat Budiarto
International Journal of Electrical and Computer Engineering (IJECE) Vol 5, No 2: April 2015
Publisher : Institute of Advanced Engineering and Science

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (347.926 KB) | DOI: 10.11591/ijece.v5i2.pp371-378

Abstract

Multimedia becomes one of the most wanted content in the modern Internet world. Since the Mobile Internet Protocol version 6 (MIPv6) was proposed, many researchers have tried to develop a new protocol based on this technology in order to improve the performance of mobile multimedia services. The world is emerging toward the Mobile Internet Protocol Television (MIPTV) era where people are enabled to watch television while roaming. The MIPTV technology requires high bandwidth and low latency handover. This paper proposes a new model of secure and robust handover with low handover latency, called SeamSAR. The model introduces a new way to perform home binding update and correspondent binding update simultaneously. Simulation results show that the proposed model reduced the handover latency to 63% compared to FMIPv6. Moreover, the secureness of the proposed model was verified using CMurphi simulator.
Network-on-Chip Paradigm for System-on-Chip Communication Rahmat Budiarto; Lelyzar Siregar; Deris Stiawan
Computer Engineering and Applications Journal Vol 6 No 1 (2017)
Publisher : Universitas Sriwijaya

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (36.543 KB) | DOI: 10.18495/comengapp.v6i1.186

Abstract

Developments of modern technologies in electronics, such as communication, Internet, pervasive and ubiquitous computing and ambient intelligence have figured largely our life. In our day micro-electronic products inspire the ways of learning, communication and entertainment. These products such as laptop computer, mobile phones, and personal handheld sets are becoming faster, lighter in weight, smaller in size, larger in capacity, lower in power consumptions, cheaper and functionally enhanced. This trend will persistently continue. Following this trend, we could integrate more and more complex applications and even systems onto a single chip. The System-on-Chip (SoC) technologies, where complex applications are integrated onto single ULSI chips became key driving force for the developments.
Co-Authors Deris Stiawan Ismat Aldmour Rahmat Budiarto Thair Al-Dala’in Yundari, Yundari