Jurnal Asiimetrik: Jurnal Ilmiah Rekayasa Dan Inovasi
Volume 5 Nomor 2 Tahun 2023

Pengaruh Tebal Deposit Lasan Terhadap Properti Lapisan Menggunakan Elektroda HV 450

Syaripuddin Syaripuddin (Universitas Negeri Jakarta)
Sopiyan Sopiyan (Universitas Negeri Jakarta)
Alpi Cahyadi (Universitas Negeri Jakarta)
Sigit Dwi Yudanto (Pusat Riset Metalurgi-Badan Riset dan Inovasi Nasional)
Muhammad Yunan Hasbi (Pusat Riset Metalurgi-Badan Riset dan Inovasi Nasional)
Ferry Budhi Susetyo (Universitas Negeri Jakarta)

Article Info

Publish Date
31 Jul 2023

Abstract

This study investigates the effect of the increased welding layers welded by the SMAW process on distorsion, thickness, microstructure, hardness, and corrosion. The method used in this research is experimental. Low-carbon steel with a size of 150x10x10 mm was welded by the SMAW technique using an HV 450 electrode. Variations in the welding layers are single, double, and triple. The three variations of the samples were observed with a digital camera and an optical microscope. Moreover, samples were tested with a hardness tester. Corrosion testing was also carried out to determine the corrosion rate of the layers formed. The results showed that the number of SMAW welding layers affected the thickness, phase, hardness, and corrosion rate. The hardness of one layer is less than that of thicker specimens, while the corrosion rate of three layers is lower than that of less-thick samples.

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Journal Info
Jurnal Asiimetrik: Jurnal Ilmiah Rekayasa Dan Inovasi
Website

Abbrev

asiimetrik

Publisher

Universitas Pancasila

Subject

Civil Engineering, Building, Construction & Architecture Computer Science & IT Electrical & Electronics Engineering Industrial & Manufacturing Engineering

Description

Jurnal ini mempublikasikan artikel ilmiah berbasis penelitian, studi kasus, articles review, rekayasa dan inovasi yang mencakup teoritis maupun praktis serta pengembangannya. Topik artikel ilmiah yang dimuat ASIIMETRIK mencakup bidang Arsitektur, Teknik Sipil, Teknik Industri, Teknik Informatika, ...