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All Journal Journal of Applied Electrical Engineering Pharmaceutical Sciences and Research (PSR)
Nadhrah Wivanius, Nadhrah
Chemistry Universitas Indonesia
Control & Systems Engineering Electrical & Electronics Engineering

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Sintesis dan Karakterisasi Hidrogel Superabsorben Kitosan Poli(N-Vinilkaprolaktam) (Pnvcl) Dengan Metode Full Ipn (Interpenetrating Polymer Network) Wivanius, Nadhrah; Budianto, Emil
Pharmaceutical Sciences and Research
Publisher : UI Scholars Hub

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Abstract

Polymer material used for hydrogel should have capability to swell and to keep water molecules in its structure without solubilised in water. Natural polymers has functional groups which can perform as active sites in modification to produce polymer with better characteristic. Chitosan is a natural polymer which has good swelling ability but lack of structural strength. Synthesis of chitosan hydrogel by interpenetrating polymer network (IPN) will increase its strength through crosslinking. In this research, the first step of modification was the synthesis of chitosan polymer network crosslinked by acetaldehyde. The next step was the synthesis of PNVCL polymer network crosslinked by N,N-methylbisacrylamide (MBA) through free radical polymerization of NVCL monomer with ammonium persulfat (APS) as the initiatior. Optimum reaction time, chitosan/PNVCL ratio (w/w %), concentration of crosslinker agent, and concentration of initiator had been observed. The optimum conditions were obtained as followed: 2 hours reaction, the ratio chitosan/PNVCL of 90:10 (w/w %), %-w MBA concentration of 0,5%, and APS concentration of 3%. The swelling ratio of the hydrogel was 380,66% while the crosslinking degree was 60,85%. Fourier transfor infrared spectroscopy (FTIR), Differential Scanning Calorimetry (DSC), Thermogravimetric analysis (TGA), Scanning Electron Microscope (SEM), and X-Ray diffraction (XRD) were used for the characterization of the hydrogel.
Pengukuran Kemampuan Manufaktur PCB Empat Layer di TFME Octowinandi, Vivin; Risandriya, Sumantri K.; Asaad, Nur Sakinah; Diputra, Muhammad Naufal Airlangga; Ria, Riki; Pratama, Adjie Sukma; Wivanius, Nadhrah
Journal of Applied Electrical Engineering Vol 8 No 1 (2024): JAEE, June 2024
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v8i1.6991

Abstract

Saat ini PCB multi-layer banyak digunakan pada rangkaian elektronik karena mampu menyediakan PCB dengan kepadatan komponen yang lebih tinggi, kecepatan tinggi dan ukuran PCB yang relatif lebih kecil dibandingkan dengan PCB single layer. Untuk menjawab kebutuhan pasar, TFME (Teaching Factory Manucacturing of Electronics) yang merupakan salah satu laboratorium di lembaga Politeknik Batam, dirasa perlu melakukan penelitian untuk mengukur kemampuan produksi di bidang manufaktur PCB multi-layer, khususnya empat layer. Total PCB empat layer yang dibuat adalah sejumlah sembilan belas unit. Adapun metoda yang digunakan untuk mengukur kemampuan TFME dalam membuat PCB empat layer adalah dengan cara mengukur kesesuaian koneksi jalur tembaga terhadap desain dan pengecekan visual kesejajaran antar layer menggunakan mesin x-ray. Dari hasil pengujian dapat diketahui bahwa untuk PCB yang menggunakan via ukuran 0.7mm tidak memiliki cacat jalur putus.
Co-Authors Asaad, Nur Sakinah Diputra, Muhammad Naufal Airlangga Emil Budianto Octowinandi, Vivin Pratama, Adjie Sukma Ria, Riki Risandriya, Sumantri K.