Jurnal Teknologi Informasi dan Pendidikan
Vol 14 No 3 (2021): Jurnal Teknologi Informasi dan Pendidikan (Special Issue)

Virtual Build Design of Simulator Soldering

Ahmaddul Hadi (Universitas Negeri Padang)
Muhammad Zuharmando Ghaffara (Universitas Negeri Padang)
Noval Yusri Yandi (Universitas Negeri Padang)
Khairi Budayawan (Universitas Negeri Padang)
Bayu Ramadhani Fajri (Universitas Negeri Padang)



Article Info

Publish Date
21 Mar 2022

Abstract

Electronic devices used by humans are often damaged. solder is the solution for repairing electronic devices. If someone wants to learn to use solder, they must study independently by watching video tutorials, when practiced without supervision is quite dangerous and this has a direct impact on workplace safety. The purpose of this research is to produce a Virtual Reality soldering application. Several stages were carried out in making this Virtual Reality soldering application, including analysis, design, development, and validation tests. The analysis is carried out by several processes including system requirements analysis and material analysis. In designing applications and creating virtual reality applications, Unity software is used as a game engine, and blender software is used to create 3-dimensional object assets. The results of the expert validation test of the virtual solder simulator media from the aspects of media design, software, and benefits obtained a score of 77.

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Journal Info

Abbrev

tip

Publisher

Subject

Computer Science & IT Control & Systems Engineering Education Engineering

Description

Jurnal Teknologi Informasi dan Pendidikan (JTIP) is a scientific journal managed by Universitas Negeri Padang and in collaboration with APTEKINDO, born from 2008. JTIP publishes scientific research articles that discuss all fields of computer science and all related to computers. JTIP is published ...