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All Journal FLYWHEEL : Jurnal Teknik Mesin Untirta Prosiding Semnastek Jurnal POLIMESIN Jurnal Mekanova : Mekanikal, Inovasi dan Teknologi International Journal of Engineering, Science and Information Technology Malikussaleh Journal of Mechanical Science Technology Jurnal Teknologi Kimia Unimal
Muhammad Muhammad
Program Studi Teknik Material, Universitas Malikussaleh
Aerospace Engineering Astronomy Automotive Engineering Biochemistry, Genetics & Molecular Biology Chemical Engineering, Chemistry & Bioengineering Chemistry Civil Engineering, Building, Construction & Architecture Computer Science & IT Control & Systems Engineering Decision Sciences, Operations Research & Management Earth & Planetary Sciences Education Electrical & Electronics Engineering Energy Engineering Environmental Science Industrial & Manufacturing Engineering Library & Information Science Materials Science & Nanotechnology Mathematics Mechanical Engineering Physics Social Sciences Transportation

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Journal : Jurnal POLIMESIN

 1 
Review Of Multicrystalline Silicon Wafer Solar Cell Processing Azwar Azwar; Luthfi Luthfi; Muhammad Muhammad
Jurnal POLIMESIN Vol 19, No 1 (2021): February
Publisher : Politeknik Negeri Lhokseumawe

Show Abstract | Download Original | Original Source | Check in Google Scholar | Full PDF (694.391 KB) | DOI: 10.30811/jpl.v19i1.2090

Abstract

The challenges for searching and utilizing  of new and sustainable energy sources especially solar cell electricity. The major obstacle of using solar cells for electricity generation has been a much higher price when compared to the price of electricity generated from the traditional sources. The photovoltaic industry needs to put an enormous pressure and optimization at every stage of the photovoltaic manufacturing chain of multicrystalline silicon wafer solar cell processing  in order to reduce cost.  Processing of multicrystalline silicon solar cells  is starting by silicon wafer preparation, etching and texturing,  saw damage etching, surface texturing, phosphor diffusion edge isolation, phosphor diffusion, edge isolation, silicon nitride deposition for antireflection coating, and metallization process that consist of screen printing ag front side, screen printing of al back side, drying and firing and formation al back surface contact.  Mechanical stability of silicon wafer became a serious issue due to reduction of wafer thickness, so probability for wafer to breakage is high; investigate the mechanism of wafer breakage is important to reduce breakage. The present of micro cracks reduces the mechanical strength of wafer significantly and wafer breakage will increase, because crack will start from the existing micro crack and that will propagate easier with presence of the stress. Mechanical stability is increase significantly after the etching process; on the other hand the screen printing process will reduce wafer strength.  Etching of saw damage, that is induced during wafer slicing, and metallization of the surfaces are 2 crucial processing steps in the manufacturing of mc-silicon solar cells
Co-Authors Arpan Apandi S Asnawi Azwar Azwar Edy Yusuf Laksono Trisnantoro Luthfi Luthfi M. Rifai Adithia Mudi Hafli, Teuku Muhammad Sayuti Nurdin Ali Nurul Islami, Nurul Reza Putra Syahrizal Fonna Syifaul Huzni T Hafli